AMI's Thin Wall Packaging 2014 took place on June 18-19, 2013 at The Westin Chicago North Shore in Chicago, IL, USA. Thin Wall Packaging 2013 offered a unique networking opportunity for leading food companies, retailers, packaging manufacturers, researchers, and suppliers of the industry to debate the latest developments and market trends in lightweight plastics packaging.
Thin Wall Packaging like tubs, cups, pots, trays, clamshells and plastic jars, provides a means of supplying consumer appeal, convenience and product protection, whilst reducing the carbon footprint. Barrier properties can be tailored to the application by careful material selection to be cost-effective. Innovative designs are enabled by developments in manufacturing technology. Applications include margarine, yogurt, ice cream, meat, bakery, fresh fruit and vegetables. TV dinners are a rapidly growing market as households work harder: microwave, freezer and oven-proof containers are included in this sector.
Thin Wall Packaging 2013 provided lively interaction and debate between the speakers and delegates, and gave a comprehensive overview of the latest materials, technology and market trends in lightweight packaging.
For information on attending, sponsoring or speaking at the next event; please contact Ms. Amanda Schaeffer,
email: firstname.lastname@example.org Tel: +1 610 478 0800