AMI’s Multilayer Packaging Films 2013 took place June 5-6, 2013 at the DoubleTree Chicago Magnificent Mile in Chicago, Illinois.
AMI’s fourth North American conference on Multilayer Packaging Films covered a range of current technical and commercial issues including new films and materials, interlayer adhesion, practical applications of nanotechnology, biodegradable barrier films, production technology (such as coextrusion and coating), applications and markets.
This conference provided an international forum for all companies involved in the manufacture and use of multilayer packaging films, be they brand owners, manufacturers, converters or suppliers. It offered an opportunity to network with professionals from the flexible packaging industry and to keep up to date with the latest developments and market trends.
For further information on this conference please contact Amanda Schaeffer, Conference Coordinator at email@example.com or call +1 610 478 0800.