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International business and technology conference for the specialty flexible packaging industry

28-29 June 2016, Chicago Marriott O'Hare, Chicago, IL

Organized by Applied Market Information LLC (AMI)

TOSAF COMPOUNDS Ltd.
AMI’s 7th North American conference on Multilayer Packaging Films will cover a range of current technical and commercial issues including new films and materials, barrier properties and testing, production technology (such as coextrusion and coating), applications and markets. 

Multilayer Packaging Films 2016 will take place on June 28-29 at the Chicago Marriott O'Hare in the beautiful city of Chicago, at the center of the packaging industry.

This conference will provide an international forum for all companies involved in the manufacture and specification of film packaging, be they brand owners, manufacturers, converters or suppliers. It offers an opportunity to network with professionals from the flexible packaging industry and to keep up to date with the latest developments and market trends.

Multilayer Packaging Films 2016 will offer a lively interaction between an international panel of speakers and delegates, which stimulated debate in all sectors.

For further information on this conference, please contact Ms. Amanda Schaeffer, Conference Coordinator at as@amiplastics-na.com or call +1 610 478 0800.

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