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International conference on light weight plastic tubs, trays, jars, containers and cups for food packaging

23-24 May 2017, Westin Chicago North Shore, Chicago, IL,

Organized by Applied Market Information LLC (AMI)

The 6th AMI international conference on thin wall packaging ​​took place on May 23-24, 2017 at The Westin Chicago North Shore in Chicago, IL, USA. Located in the heart of the ​packaging industry, attendees participated in second-to-none networking and experienced a compelling conference program.

Thin Wall Packaging 2017 offered a unique networking opportunity for leading food companies, retailers, packaging manufacturers, researchers, and suppliers of the industry to debate the latest developments and market trends in light weight plastics packaging.  In conjunction to the conference, Intertek hosted a food packaging safety and regulatory compliance seminar on May 25th.

For further information on this conference, please contact Amanda Schaeffer, Sr. Conference Coordinator at or call +1 610 478 0800.